- AQG 324 Test Standard
- Automatic Test Equipment (ATE)
- Burn-in
- Curve Tracer (Parameter Analyzer)
- Dielectric Breakdown Testing
- Dielectric Withstand Test
- Double Pulse Testing
- Electric Light Source (Lamp, Artificial Light)
- Electron Beam
- Electron Beam (E-Beam) Evaporation
- Electron Beam (E-Beam) Welding
- Electron Beam Lithography (EBL)
- Electron Microscope
- Electrostatic Chuck (E-Chuck, ESC)
- Electrostatic Discharge (ESD) Testing
- Electrostatic Levitation
- Fast Atom Beam (FAB) Gun
- Focused Ion Beam (FIB)
- High Voltage Amplifiers
- High Voltage Power Supplies
- Insulation Breakdown Test
- Ion Beam
- Ion Implantation
- Ion Milling
- Ion Pump
- Ionizer
- Langmuir Probe
- Lock-in Thermography
- Nondestructive Testing (NDT)
- Photovoltaics (PV)
- Physical Vapor Deposition (PVD)
- Plating
- Power Amplifier
- RF Amplifier
- Scanning Electron Microscope (SEM)
- Semiconductor Fabrication Equipment
- Spark Plasma Sintering (SPS)
- Sputtering
- Surface Activated Bonding (SAB)
- Transmission Electron Microscopes (TEM)
- Vacuum Gauge
- Vacuum Plasma Treatment
- X-ray Analysis
- X-ray Detector
- X-ray Photoelectron Spectroscopy (XPS)
Semiconductor
Matsusada Precision provides high-performance power supply solutions and precision measurement systems designed for the semiconductor manufacturing industry. From crystal growth and wafer fabrication to final testing and inspection, our products ensure stable performance and high reliability in demanding production environments. We support a wide range of applications, including plasma processes, ion implantation, and quality control, helping engineers achieve higher yields and process precision.
Semiconductor Manufacturing Process
| Process | Recommended Products & Applications |
|---|---|
| 1. Ingot Growth | - |
| 2. Ingot Slicing | - |
| 3. Wafer Cleaning | Vacuum Plasma Treatment |
| 4. Wafer Polishing | Piezo Actuator, Piezo Driver |
| 5. Thermal Oxide Wafer | Heater Power Supply |
| 6. Photoresist Coating | - |
| 7. Photolithography | Electron Beam Lithography (EBL) Piezo Actuator, Piezo Driver |
| 8. Stepper exposure | Piezo Actuator, Piezo Driver |
| 9. Etching | Dry Etching Plasma Etching Reactive-ion Etching (RIE) Atomic Layer Etching (ALE) Electrostatic chuck |
| 10. Deposition | Atomic Layer Deposition (ALD) Physical Vapor Deposition (PVD) Plasma Enhanced Chemical Vapor Deposition (PECVD) Electron Beam (E-Beam) Evaporation Ion Beam Deposition Heater Power Supply Electrostatic chuck |
| 11. Chemical Mechanical Planarization (CMP) | - |
| 12. Oxidation | - |
| 13. Ion implantation | Ion Beam, Ion Acceleration, Ion Beam Steering, Ion Source |
| 14. Diffusion | - |
| 15. Surface activated bonding (SAB) | Fast Atom Beam (FAB) Gun |
| 16. Wafer Inspection | - |
| 17. Wafer dicing | Photomultiplier Tubes (PMT) |
| 18. Wafer mounting | - |
| 19. Wafer bonding | Plating |
| 20. Integrated circuit packaging | Electron Beam (E-Beam) Welding |
| 21. Burn-in | Burn-in |
| 22. Testing and Inspection | Curve tracer (parameter analyzer) Device Analyzer Drain-Source On-State Resistance Measurement Common-Mode Transient Immunity (CMTI) Testing Dielectric Breakdown Testing Electrostatic Discharge Testing (ESD) Insulation breakdown testing Hipot testing Dielectric withstand test Electrical isolation test High Voltage Power Supply Electron Microscope Analytical X-Ray |
| 23. Marking | - |
| Overall process | Clean Room, Clean Booth,Clean Bench,Ion pump |