Room temperature wafer bonding, also known as Surface Activated Bonding (SAB), can be performed at room temperature without the high temperatures of conventional bonding methods.

It can be bonded at room temperature without the need for high temperatures as in conventional bonding methods. As a result, there is no thermal damage or thermal stress effect. Other advantages include high bonding quality and a dry process without wet chemical cleaning.

Surface-activated bonding is used not only for bonding wafers at room temperature, but also for bonding metals.