Semiconductor Manufacturing Process

Process Matsusada Products/purpose
1. Ingot Growth -
2. Ingot Slicing -
3. Wafer Cleaning Vacuum Plasma Treatment
4. Wafer Polishing Piezo actuator, Piezo driver
5. Thermal Oxide Wafer Heater power supply
6. Photoresist Coating -
7. Photolithography Electron Beam Lithography (EBL)
Piezo actuator, Piezo driver
8. Stepper exposure Piezo actuator, Piezo driver
9. Etching Electrostatic chuck
10. Deposition Electron Beam (E-Beam) Evaporation
Ion Beam Deposition
Heater power supply
11. Chemical Mechanical Planarization (CMP) -
12. Oxidation -
13. Ion implantation Ion Beam, Ion Acceleration, Ion Beam Steering, Ion Source
14. Diffusion -
15. Surface activated bonding (SAB) Fast Atom Beam (FAB) Gun
16. Wafer Inspection -
17. Wafer dicing Electrostatic chuck
18. Wafer mounting -
19. Wafer bonding Plating
20. Integrated circuit packaging Electron Beam (E-Beam) Welding
21. Burn-in Burn-in
22. Testing and Inspection Semiconductor Curve tracer (parameter analyzer)
Device analyzer
Drain-source on-state resistance measurement
Common-Mode Transient Immunity (CMTI) test
Dielectric Breakdown Testing
Electrostatic Discharge Testing (ESD)
Insulation breakdown testing
Electrical isolation test
High Voltage Power Supply
Electron Microscope
Analytical X-Ray
23. Marking -
Overall process Clean Room, Clean Booth,Clean Bench,Ion pump