Semiconductor Manufacturing Process

Process Matsusada Products/purpose
1. Ingot Growth -
2. Ingot Slicing -
3. Wafer Cleaning Vacuum Plasma Treatment
4. Wafer Polishing Piezo actuator, Piezo driver
5. Thermal Oxide Wafer Heater power supply
6. Photoresist Coating -
7. Photolithography Electron Beam Lithography (EBL)
Piezo actuator, Piezo driver
8. Stepper exposure Piezo actuator, Piezo driver
9. Etching Electrostatic chuck
10. Deposition Atomic Layer Deposition (ALD)
Physical Vapor Deposition (PVD)
Plasma Enhanced Chemical Vapor Deposition (PECVD)
Electron Beam (E-Beam) Evaporation
Ion Beam Deposition
Heater power supply
Electrostatic chuck
11. Chemical Mechanical Planarization (CMP) -
12. Oxidation -
13. Ion implantation Ion Beam, Ion Acceleration, Ion Beam Steering, Ion Source
14. Diffusion -
15. Surface activated bonding (SAB) Fast Atom Beam (FAB) Gun
16. Wafer Inspection -
17. Wafer dicing Photomultiplier Tubes (PMT)
18. Wafer mounting -
19. Wafer bonding Plating
20. Integrated circuit packaging Electron Beam (E-Beam) Welding
21. Burn-in Burn-in
22. Testing and Inspection Semiconductor Curve tracer (parameter analyzer)
Device analyzer
Drain-source on-state resistance measurement
Common-Mode Transient Immunity (CMTI) test
Dielectric Breakdown Testing
Electrostatic Discharge Testing (ESD)
Insulation breakdown testing
Electrical isolation test
High Voltage Power Supply
Electron Microscope
Analytical X-Ray
23. Marking -
Overall process Clean Room, Clean Booth,Clean Bench,Ion pump