FAB gun is an abbreviation for Fast Atom Beam gun, which is a generator of fast atomic beams used for room temperature bonding of semiconductor wafers. Fast atom beams have higher energy than conventional argon ion guns and can strongly remove oxide rays.

Equipment that uses FAB is called room temperature wafer bonding/surface activated bonding (SAB) equipment.

For more information on room temperature wafer bonding/surface activated bonding (SAB) equipment,click here.