X-ray Inspection of Wire bonding of IC chips

Release: 2023-03-20, M.P. Update: 2026/01/28, T.N.

In semiconductor manufacturing, X-ray inspection is used to examine the state of wire bonding at high magnification, checking for issues such as wire breakage, pitch deviation, and poor bonding.

Once sealed with resin molding, IC chip wire bonding cannot be inspected visually. Furthermore, the wires have a fine structure of approximately 20 to 30 μm. Therefore, a high-resolution X-ray system is required for effective inspection.

Inspecting for wire breakage, poor bonding, and wire sweep requires X-ray imaging that remains clear even at high magnification. To achieve this, the X-ray inspection system must allow for a small focal spot size.

Matsusada Precision's X-ray inspection systems feature proprietary microfocus X-ray tubes. Leveraging our expertise in high-voltage power supplies, we have achieved industry-leading focal spot sizes of 5 μm for benchtop systems and 4 μm for stationary systems, ensuring clear observation. With advanced CT technology, we also offer 2D and 3D CT scan functions designed to inspect wire bonding for three-dimensional shape and delamination.

Additionally, X-ray inspection is effective for authenticating semiconductor IC chips and detecting counterfeits.