PCB Assembly application X-ray Inspection

Power Semiconductors and Power Modules for X-ray Inspection Application

X-ray inspection is essential for power semiconductors and power modules in production quality control and analysis. The semiconductor chips (dies) made of Silicon Carbide (SiC) or Gallium Nitride[...]

Wire bonding of IC chips for X-ray Inspection Application

In semiconductor magnified X-ray inspections, the state of wire bonding is examined at an enlarged scale, checking for issues such as wire breakage, pitch deviation, and poor bonding. IC chip wire[...]

Enlarged Observation of BGA Solder Joint

The causes of BGA malfunctions include bump voids, cracks, warpages, and deformations. BGA bumps are located on the underside of the chip, and we cannot visually inspect them. The bump de[...]

BGA solder condition for X-ray Inspection Application

BGA stands for Ball Grid Array and is a semiconductor IC package with solder balls called bumps array on its bottom surface. When mounted on a printed Printed circuit board (PCB), solder [...]

X-Ray Inspection Examples (BGA, LED wire bonding, etc.)

X-ray inspection of BGA (Ball Grid Array) and CSP (Chip Scale Package) is one of the non-destructive inspection methods to evaluate the solder joint condition. This inspection method [...]

SMT (PCB Assembly)

Power Semiconductors and Power Modules for X-ray Inspection Application

Wire bonding of IC chips for X-ray Inspection Application

Enlarged Observation of BGA Solder Joint

BGA solder condition for X-ray Inspection Application

X-Ray Inspection Examples (BGA, LED wire bonding, etc.)

application

X-ray Inspection Systems Solutions