X-ray inspection is essential for power semiconductors and power modules in production quality control and analysis. The semiconductor chips (dies) made of Silicon Carbide (SiC) or Gallium Nitride (GaN) and substrate are bonded by using Sintering, Die bonding, and Die-attach methods.
In the bonding process, void (cavity) defects in the bonding surface will deteriorate heat dissipation and affect product performance and service life. The X-ray system provides high-quality images, making it easy to quickly find defects of hidden shrinkage cavities, voids, cracks, etc. As thin power modules are required in the mounting process, Direct Bonding Copper (DBC), Direct Brazed Aluminum (DBA), or Active Metal Brazed/ Active Metal Bond (AMB) substrates are used.
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