X-ray inspection plays a critical role in the quality control and failure analysis of power semiconductors and power modules. Reliable bonding between semiconductor dies--such as Silicon Carbide (SiC) or Gallium Nitride (GaN)--and substrates is achieved through advanced die-attach methods, including sintering and soldering.
During the bonding process, internal defects like voids, cracks, or shrinkage cavities can compromise heat dissipation, significantly affecting product performance and reliability. High-resolution X-ray inspection systems allow for the non-destructive detection of these hidden defects. This is particularly essential for modern power modules utilizing Direct Bonded Copper (DBC), Direct Brazed Aluminum (DBA), or Active Metal Brazing (AMB) substrates, where structural integrity is paramount.
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