X-ray inspection is essential for identifying defects in connectors, harnesses, crimped parts, and soldered joints. It enables non-destructive detection of internal wire breakage, shorts, missing crimps, and solder voids. For connectors with multiple pins, overlapping metal parts can obscure defects. To address this, the system allows for oblique observation by rotating the sample stage, ensuring a clear view from multiple angles.
The μRay8700 X-ray inspection system features a high-power 130 kV, 40 W microfocus X-ray source, delivering clear images even through dense overlapping metal components. Additionally, the optional CT scan function enables cross-sectional analysis, providing a detailed view of internal cable strands within crimping areas and identifying solder voids.
| Focal Spot | Microfocus |
|---|---|
| X-ray Tube Voltage | 90 to 130 kV |
| Magnification | 1 to 100x |
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