Sputtering

Sputtering is a Physical Vapor Deposition (PVD) technique used to deposit a thin film of material onto a substrate.

It involves introducing a controlled gas, such as argon, and a material which is called the target for thin film coating. When a negative voltage is applied to the target, a glow discharge is generated. Positive ions from the resulting inert gas plasma are then accelerated towards the target, bombarding its surface at high speed.

This bombardment ejects atoms from the target, a process known as sputtering. These ejected atoms then travel and deposit onto the substrate, forming a thin film.

Sputtering is one of the most efficient systems to obtain film thickness distribution, and it has the ability to control film quality and thickness with high precision. The sputtering deposition is suitable for high-melting-point metals and alloys, and it can also create a thin, precise coating of oxides and nitrides by using a reactive gas.

The sputtering method has many applications in semiconductor wiring, barrier films, and transparent conductive films used for smartphones and tablets. It is also used to create highly reflective coatings for automotive headlight reflectors and to produce various decorative films.

Related words:

Physical Vapor Deposition (PVD)
Plasma
Semiconductor
Flat Panel Display (FPD)
Thin film
Sputter
High voltage

Recommended products

There are two methods of sputtering: a DC (direct current) power supply for sputtering and an RF (radio frequency) power supply. Both DC and RF can be used for metal targets for sputtering deposition. However, for insulating (dielectric) targets, an RF (Radio Frequency) power supply is required. This is because a DC voltage would cause positive charge to build up on the target surface (a phenomenon known as "charge-up"), which quenches the plasma discharge. Please note that our standard power supplies are not specifically designed to handle the frequent arcing or abnormal discharges that can occur in sputtering processes. Customers who intend to use these products for sputtering applications should contact our sales office in advance.
Matsusada Precision offers power supply solutions for vacuum and deposition process applications. We also manufacture other products, such as electrostatic chucks and piezo drivers in semiconductor and FPD manufacturing equipment.

RE series

voltage range: 10 to 650 V

current: 1.2 to 1200 A

power: 0.75 to 15 kW

A Programmable DC Power Supply Available in 147 Models

Low noise, High power, compact and high efficiency

REH series

voltage range: 0.75 to 1.2 kV

current: 1.1 to 20 A

power: 1.1 to 15 kW

High-Power DC Power Supply
(Up to 1.2 kV)

1 kV/15 kW class design with enhanced safety features

REK/REKJ series

voltage range: 6 to 1500 V

current: 1.2 to 1200 A

power: 0.77 to 15 kW

Versatile, High-performance
DC power supply

Compact and high power, featuring a PFC circuit and universal input for various operations.

PRT series

voltage range: 80 to 1500 V

current: 33 to 510 A

power: 5 to 15 kW

High Power Autoranging DC Power Supply

Features autoranging output and a variable internal resistance function.

NEW

HARS series

voltage range: 1 to 120 kV

current: 4.16 to 3000 mA

power: 0.5 to 3 kW

Low-Profile Digital High Voltage Power Supply

The low-ripple HARS series features full protection circuit and a 4-digit digital meter.

AU series

voltage range: 1 to 120 kV

current: 0.25 to 2200 mA

power: 30 to 2200 W

Rack mount High Voltage DC Power Supply

The AU series offers a low-profile, lightweight design with over 300 models. It features remote control and monitoring functions, with a digital interface available.