Yes, it is possible. However, scanning materials with significantly different X-ray absorption rates--such as metal and resin--can be technically challenging. The primary difficulty lies in maintaining clear contrast at the interfaces without generating image artifacts.
High-density metals absorb X-rays strongly, often causing metal artifacts (streaks or shading) in the resulting images. In metal-insert molded parts, these artifacts can blur the surrounding resin. Similarly, on printed circuit boards (PCBs), artifacts from solder joints may obscure details in adjacent components.
To overcome this, Matsusada Precision's micro-CT systems utilize high-stability X-ray sources and high-sensitivity detectors to capture precise raw data. Our reconstruction software features specialized metal artifact reduction algorithms that effectively suppress distortions. This technology improves visibility at the metal-resin interface, a traditionally difficult area to inspect.
These capabilities allow for accurate verification of resin fill levels, void detection in insert-molded parts, and integrity evaluation of BGA solder joints. If you encounter difficulties inspecting samples with high-density contrast, please contact us. We can propose optimal scanning conditions tailored to your specific application.
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