Is it possible to inspect molded parts and composite materials containing metal and resin?

Yes, this is possible. However, when materials with substantially different X-ray absorption rates, such as metals and resins, are combined, X-ray CT inspection becomes technically challenging due to artifacts and limited contrast at the interfaces.

When scanning such materials, it is common to encounter **metal artifacts**--image distortions, such as streaks, caused by the high X-ray absorption of the metal. For example, in metal-insert molded parts, the resin area around the metal component may appear blurry. Similarly, on an electronic circuit board, artifacts from solder joints can **obscure details** in other areas.

To address this challenge, Matsusada Precision's X-ray CT systems first acquire high-quality raw data using a stable X-ray source and a high-sensitivity detector. Then, specialized artifact reduction algorithms integrated into our software effectively suppress these distortions during image reconstruction. This advanced image processing technology enhances the visibility of the interface between metal and resin, which has traditionally been difficult to observe.

As a result, our systems enable more accurate inspections, such as verifying resin fill levels, detecting voids in metal-insert molded parts, and evaluating the **integrity** of BGA solder joints on printed circuit boards. If you are facing challenges with inspecting samples containing materials with large differences in absorption rates, please contact us. We can propose the optimal scanning conditions tailored to your specific sample.

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