X-ray Inspection of Power Semiconductors and Power Modules X-ray inspection plays a critical role in the quality control and failure analysis of power semiconductors and power modules. Reliable bonding between semiconductor dies--such as Silicon Carbide[...] X-ray Inspection of IC Chip Wire Bonding In semiconductor manufacturing, X-ray inspection is used to examine the state of wire bonding at high magnification, checking for issues such as wire breakage, pitch deviation, and poor bonding.[...] High-Magnification Inspection of BGA Solder Joints Common causes of BGA connection failures include voids, cracks, warpage, and deformation. Since the solder bumps are located beneath the chip, standard visual inspection is impossible. Fu[...] X-ray Inspection of BGA Solder Joints A Ball Grid Array (BGA) is a type of surface-mount packaging for integrated circuits that utilizes a grid of solder balls, or "bumps," on its underside to conduct electrical signals. Duri[...] X-Ray Inspection Examples (BGA, LED wire bonding, etc.) X-ray inspection is a critical non-destructive method for evaluating solder joint integrity in BGAs (Ball Grid Arrays) and CSPs (Chip Scale Packages). This process visualizes the sold[...]
