Surface Activated Bonding (SAB) is a bonding technology that creates strong atomic bonds at room temperature. By activating the material surface using plasma or ion beams in a high-vacuum environment, SAB eliminates the need for heat treatment unlike conventional bonding methods.
This process prevents thermal damage and residual stress, making it ideal for bonding dissimilar materials with different thermal expansion coefficients, such as semiconductors and metals. As a completely dry process, it creates high-quality interfaces without the need for wet chemical cleaning.
- Related Terms:
-
- Surface Activated Bonding (SAB)
- wafer bonding
