For an overview of general surface finishing technologies, please refer to our technical article:
"What is surface treatment? Explaining the main types and the role of power supply"
On this page, we will introduce an advanced thin-film deposition technique known as Ion Plating.
Ion Plating is a sophisticated deposition process, notably used in demanding applications such as the U.S. space program. It falls under the category of dry processes (vacuum deposition), distinct from traditional wet plating. In the Ion Plating chamber, the source material is evaporated or sublimated in a vacuum. These particles are then passed through a plasma field, where a significant portion becomes ionized (forming positively charged ions). These positively charged ions are accelerated toward the substrate, which is held at a high negative bias voltage (usually powered by a specialized DC or pulsed DC power supply). The high-energy impact of these accelerated ions on the substrate surface promotes excellent film adhesion, resulting in a dense, high-quality thin film. Compared to conventional vacuum evaporation, the enhanced kinetic energy of the ions upon impact makes Ion Plating ideal for producing thin films with superior hardness, wear resistance, and adhesion.
