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What is the difference between sintering and die-attach in power semiconductors?

X-Ray Inspection System FAQ

Sintering (Sinter joint) is a manufacturing process that uses silver-sintering paste to connect power electronics components with high melting points. The silver sintering is used for bonding semiconductor chips (dies) and DBC substrates, etc., achieving high thermal conductivity.

Sintering can be divided into two types: Pressurized sintering and Pressureless sintering.
Adhesive or solder bonds a semiconductor and substrate material, called "Die-attach" or "Die bonding". You can select two types of bonding agents: conductive and insulating.

X-ray system is used for power semiconductor and module applications to detect sintering shrinkage, voids in poor wetting, and cracks.