X-ray inspection and micro-CT scan are used for non-destructive testing in the following fields and applications.
- Electrical and Electronics
- electronic components, disconnections / open circuits, switches, capacitors, batteries, layer shift, BGA solder joint integrity, solder, Printed Circuit Boards (PCBs), probes, springs, wires, semiconductors, ICs, wire bonding, lenses, connectors, cables, heaters, sensors, contactors, LEDs, lamps, motors
- Metal processing fields
- die-cast products, castings, porosity/voids in castings, turbine blades, engines, welds, dissimilar material joints, sintered parts, brazed joints, high-pressure vessels
- Resin related fields
- insert-molded parts, containers, caps, nozzles, CFRP, molds, Static shielding bags
- Automotive
- automotive components, pressure sensors, ultrasonic sensors, radar, cameras, engines, motors, valves, filters, injectors, tires, radiators, turbines, etc.
- Pharmaceutical, Biotechnology, and Food fields
- tablets, capsules, foreign objects, bones, seeds, vegetables, fruits, insects, small animals, dental materials, and packaging defects (e.g., seal contamination).
- Others
- textiles, mail, luggage, forensics, art, appraisals, fossils, wood, ceramics, pottery, rubber, toys, sporting goods
- Inspection items and Purpose
- foreign material contamination, internal structure analysis, cavities, voids, inclusions (e.g., soot), bubbles, component alignment / mating condition, cracks, crazing, defects, material distribution / mixing uniformity, fill rate, reverse engineering