Semiconductor Manufacturing Process

Process Matsusada Products/purpose
1. Ingot Growth -
2. Ingot Slicing -
3. Wafer Cleaning Vacuum Plasma Treatment
4. Wafer Polishing Piezo actuator, Piezo driver
5. Thermal Oxide Wafer Heater power supply
6. Photoresist Coating -
7. Photolithography Electron Beam Lithography (EBL)
Piezo actuator, Piezo driver
8. Stepper exposure Piezo actuator, Piezo driver
9. Etching Electrostatic chuck
10. Deposition Electron Beam (E-Beam) Evaporation
Ion Beam Deposition
Heater power supply
11. Chemical Mechanical Planarization (CMP) -
12. Oxidation -
13. Ion inprantation Ion Beam, Ion Acceleration, Ion Beam Steering, Ion Source
14. Diffusion -
15. Wafer Inspection -
16. Wafer dicing Electrostatic chuck
17. Wafer mounting -
18. Wafer bonding Plating
19. Integrated circuit packaging Electron Beam (E-Beam) Welding
20. Burn-in Semiconductor burn-in device
21. Testing and Inspection Electron Microscope
High Voltage Power Supply
Analytical X-Ray
Dielectric Breakdown Testing
Electrostatic Discharge Testing (ESD)
Insulation breakdown testing
Electrical isolation test
22. Marking -